Description
This working group is tasked with improving our understanding of the current state of high-power couplers (FPC and HOM) and how to incorporate them into cryomodules for low thermal impact.
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Gary Cheng (Jefferson Lab)1/27/27, 11:00 AM
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Neil Stilin (Jefferson Lab)1/27/27, 11:15 AM
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1/27/27, 11:30 AM
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1/27/27, 11:45 AM
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Wencan Xu (BNL)1/27/27, 12:00 PM